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20th IEEE Latin-American Test Symposium
(LATS'19)
11th - 13th March 2019
Santiago, Chile

http://www.lats.tttc-events.org

CALL FOR PAPERS

Scope

The IEEE Latin-American Test Symposium (LATS, previously Latin-American Test Workshop - LATW) is a recognized forum for test and fault tolerance professionals and technologists from all over the world, in particular from Latin America, to present and discuss various aspects of system, board, and component testing and fault-tolerance with design, manufacturing and field considerations in mind. Presented papers are also published in the IEEE Xplore Digital Library. The best papers of the 20th LATS will be invited to re-submit to IEEE Design & Test,Journal of Electronic Testing: Theory and Applications - JETTA (Springer), Journal of Low Power Electronics - JOLPE (American Scientific Publishers), and IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

Topics of interest include but are not limited to:

  • Analog Mixed Signal Test
  • Automatic Test Generation
  • Built-In Self-Test
  • Defect-Based Test
  • Design and Synthesis for Testability
  • Design for Electromagnetic Compatibility
  • Design for Reliable Embedded Software
  • Design Verification / Validation
  • Economics of Test
  • Fault Analysis and Diagnosis
  • Fault Modeling and Simulation
  • Fault-Tolerance in HW/SW
  • Fault-Tolerant Architectures
  • Memory Test and Repair
  • On-Line Testing
  • Process Control & Measurements
  • Radiation / EMI
  • Hardening Techniques
  • Software Fault-Tolerance
  • Software On-Line Testing
  • System-on-Chip Test
  • Test Resource Partitioning
  • Yield Optimization
  • Hardware Security

Submissions

To encourage and facilitate discussions, participation will be limited. Those interested in presenting recent results at the symposium are invited to submit an extended abstract, one to three pages long, or a full length paper. PDF electronic submissions must be done via the symposium‘s webpage: www.lats.tttc-events.org

Authors should send papers in the IEEE format. Detailed instructions are available at the symposium‘s webpage. The Program Committee also welcomes proposals for panels and special topic sessions.

Key Dates

Submission Deadline (Title and Abstract): November 9th, 2018

Submission (Full paper): November 16th, 2018

Notification of Acceptance: December 20th, 2018

Camera Ready: January 10th, 2019.

Additional Information

For additional information, please contact the Program Chair:

Victor Champac – INAOE, Mexico

champac@inaoep.mx

Marcelo Lubaszewski, UFRGS, Brazil

luba@ece.ufrgs.br

Committee

General Co-Chairs:

  • Raoul Velazco – TIMA, France
  • Yervant Zorian – SYNOPSYS, USA

Past General Chair:

  • Fabian Vargas – PUCRS, Brazil

Program Co-Chairs:

  • Victor Champac – INOAE, Mexico
  • Marcelo Lubaszewski, UFRGS, Brazil

Local Chair:

  • Victor Grimblatt – SYNOPSIS, Chile

Local Arrangement Chair:

  • Angel Abusleme – PUCC, Chile

Special Session Co-Chairs:

  • Matteo Sonza Reorda - POLITO, Italy
  • Alberto Bozio - LIRMM, France

Tutorial Co-Chairs:

  • Paolo Rech, UFGRS, Brazil
  • Luis Entrena, UC3M, Spain

Panel Co-Chairs:

  • E. Sanchez, POLITO, Italy
  • S. Hamidioui, TU Delft, The Netherlands

Finance Chair:

  • Anne-L. Fourneret Itié – TIMA, France

Publication Co-Chairs:

  • Emmanuel Simeu – TIMA, France
  • Lembit Jürimägi – TTU, Estonia

Publicity Co-Chairs:

  • Argentina: Pablo Ferreyra – UNC, Argentina
  • Brazil: Fernanda Kastendsmidt – UFRGS, Brazil
  • Colombia: Felipe Restrepo Calle – UNAL, Colombia
  • Central America: Alberto Chaves – DLR, Costa Rica
  • North America: Adit Singh – Auburn University, USA
  • Europe : Giorgio Di Natale – LIRMM, France
  • Asia: Xiaowei Li – Chinese Acad. of Science, China

TTEP Tutorials Liaison:

  • Letíca Maria Bolzani Poehls – PUCRS, Brazil

IEEE – CEDA Liaison:

  • David Atienza – EPFL, Switzerland

IEEE D&T Liaison:

  • Kaushik Roy – Purdue Univ., USA

IEEE TCAD Liaison:

  • Rajesh Gupta – UCSD, USA

JETTA Liaison:

  • Vishvani Agrawal – Auburn University, USA

JOLPE Liaison:

  • Patrick Girard – LIRMM, France

Industry Liason:

  • César Dueñas – NXP, Brazil

Steering Committee:

  • Victor Champac
  • Marcelo Lubaszewski
  • Fabian Vargas
  • Raoul Velazco
  • Yervant Zorian
For more information, visit us on the web at: http://www.lats.tttc-events.org

LATS'19 is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).



IEEE Computer Society-Test Technology Technical Council

TTTC CHAIR
Chen-Huan CHIANG
Intel - USA
E-mail chen-huan.chiang@intel.com

PAST CHAIR
Michael NICOLAIDIS
TIMA laboratory - France
E-mail michael.nicolaidis@imag.fr

TTTC 1ST VICE CHAIR
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
E-mail figueras@eel.upc.es

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI

Politecnico di Torino
- Italy
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

 

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
Adith SINGH
Auburn University – USA
E-mail adsingh@eng.auburn.edu

TTTC 2ND VICE CHAIR
Rohit KAPUR
Synopsys, Inc. – USA
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com


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